By L. Hermans (auth.), Bharat Bhushan (eds.)
Micro Electro Mechanical structures (MEMS) is already a few billion money a 12 months and is turning out to be quickly. thus far significant emphasis has been put on the fabrication techniques for varied units. There are severe matters relating to tribology, mechanics, surfacechemistry and fabrics technological know-how within the operationand manufacturingof many MEMS units and those concerns are fighting a fair speedier commercialization. little or no is known approximately tribology and mechanical houses on micro- to nanoscales of the fabrics utilized in the development of MEMS units. The MEMS group should be uncovered to the state-of-the-artoftribology and vice versa. basic knowing of friction/stiction, put on and the position of floor infection and environmental particles in micro units is needed. There are significantadhesion, friction and put on matters in production and real use, dealing with the MEMS undefined. little or no is known concerning the tribology of bulk silicon and polysilicon motion pictures utilized in the development ofthese microdevices. those matters are in line with floor phenomenaand cannotbe scaled down linearly and those turn into more and more vital with the small dimension of the units. Continuum concept breaks down within the analyses, e. g. in fluid movement of micro-scale units. Mechanical homes ofpolysilicon and different movies should not good characterised. Roughness optimization will help in tribological advancements. Monolayers of lubricants and different fabrics have to be built for ultra-low friction and close to 0 put on. demanding coatings and ion implantation thoughts carry promise.
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Extra info for Tribology Issues and Opportunities in MEMS: Proceedings of the NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS held in Columbus, Ohio, U.S.A., 9–11 November 1997
Sample text
Microfluidic structures have been formed by wet etching the aluminum interconnect to form silicon dioxide capillaries on top of the substrate [10]. Currently, two foundry process services provide fabrication of CMOS-MEMS devices. m) [11]. Future plans include full support of the post-CMOS silicon etch for release of microstructures. ,--------{ metallization . ::::J---ilicon ub Irate polysilicon "......... - metal-3 (b) metal-2 melal-I (c) Figure 2. Flow for the high-aspect-ratio CMOS-MEMS process.
Embedded aluminum traces wind through the meander springs to provide interconnect between the comb fingers and bond pads. The resonator plate mass experiences an electrostatic attractive force upon application of a potential across the gap between comb fingers. Mechanical material properties are not a primary concern for CMOS foundries, which focus on reliably producing electronic circuits, not MEMS. As a result, CMOS-based microstructures can suffer from large residual stresses and stress gradients, which may vary from run to run.
Sensors and actuators on the contrary are very specific. They have to be in contact with their surroundings, and each environment imposes its own constraints. This makes the packaging more important further illustrating our earlier claim that the design should start from the packaging constraints and work its way to the miniature sensor inside rather than the other way around. For micromachines the economics dictating profitable IC manufacture, luckily, do not necessarily apply; a microinstrument, say a micro gas chromatograph, may cost considerably more than a typical IC.